WELCOME TO ASME 2023 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS (INTERPACK2023)

Sukwon Choi, Pradeep Lall, Saket Karajgikar, Damena Agonafer, Yoonjin Won, Jimil Shah, Anna Prakash

Research output: Contribution to journalEditorialpeer-review

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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