Original language | English (US) |
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Article number | v001t00a001 |
Journal | Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023 |
State | Published - 2023 |
Event | ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023 - San Diego, United States Duration: Oct 24 2023 → Oct 26 2023 |
All Science Journal Classification (ASJC) codes
- Hardware and Architecture
- Electrical and Electronic Engineering