WELCOME TO ASME 2023 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS (INTERPACK2023)

Sukwon Choi; Pradeep Lall; Saket Karajgikar; Damena Agonafer; Yoonjin Won; Jimil Shah; Anna Prakash

WELCOME TO ASME 2023 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS (INTERPACK2023)

Sukwon Choi
, Pradeep Lall
, Saket Karajgikar
, Damena Agonafer
, Yoonjin Won
, Jimil Shah
, Anna Prakash

Mechanical Engineering

Research output: Contribution to journal › Editorial › peer-review

Original language	English (US)
Article number	v001t00a001
Journal	Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023
State	Published - 2023
Event	ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023 - San Diego, United States Duration: Oct 24 2023 → Oct 26 2023

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Electrical and Electronic Engineering

Cite this

Choi, S., Lall, P., Karajgikar, S., Agonafer, D., Won, Y., Shah, J., & Prakash, A. (2023). WELCOME TO ASME 2023 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS (INTERPACK2023). Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023, Article v001t00a001.

Choi, Sukwon ; Lall, Pradeep ; Karajgikar, Saket et al. / WELCOME TO ASME 2023 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS (INTERPACK2023). In: Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023. 2023.

@article{6f113a7358434d5fa3b13eb7bdbd96ef,

title = "WELCOME TO ASME 2023 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS (INTERPACK2023)",

author = "Sukwon Choi and Pradeep Lall and Saket Karajgikar and Damena Agonafer and Yoonjin Won and Jimil Shah and Anna Prakash",

year = "2023",

language = "English (US)",

journal = "Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023",

note = "ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023 ; Conference date: 24-10-2023 Through 26-10-2023",

}

Choi, S, Lall, P, Karajgikar, S, Agonafer, D, Won, Y, Shah, J & Prakash, A 2023, 'WELCOME TO ASME 2023 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS (INTERPACK2023)', Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023.

WELCOME TO ASME 2023 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS (INTERPACK2023). / Choi, Sukwon; Lall, Pradeep; Karajgikar, Saket et al.
In: Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023, 2023.

Research output: Contribution to journal › Editorial › peer-review

TY - JOUR

T1 - WELCOME TO ASME 2023 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS (INTERPACK2023)

AU - Choi, Sukwon

AU - Lall, Pradeep

AU - Karajgikar, Saket

AU - Agonafer, Damena

AU - Won, Yoonjin

AU - Shah, Jimil

AU - Prakash, Anna

PY - 2023

Y1 - 2023

UR - https://www.scopus.com/pages/publications/85179873305

UR - https://www.scopus.com/pages/publications/85179873305#tab=citedBy

M3 - Editorial

AN - SCOPUS:85179873305

JO - Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023

JF - Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023

M1 - v001t00a001

T2 - ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023

Y2 - 24 October 2023 through 26 October 2023

ER -

Choi S, Lall P, Karajgikar S, Agonafer D, Won Y, Shah J et al. WELCOME TO ASME 2023 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS (INTERPACK2023). Proceedings of ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2023. 2023;v001t00a001.

WELCOME TO ASME 2023 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS (INTERPACK2023)

All Science Journal Classification (ASJC) codes

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Cite this