TY - GEN
T1 - Weldability of titanium alloy using transient liquid phase diffusion bonding method
AU - Rahman, A. H.M.E.
AU - Abu-Mahfouz, Issam
N1 - Publisher Copyright:
© 2016 MS and T16®.
PY - 2016
Y1 - 2016
N2 - The viability of joining of titanium alloy using transient liquid phase (TLP) diffusion bonding was investigated. Commercially pure Ti (grade-2 Ti), and grade-5 (Ti Ti-6Al-4V) have been TLP bonded using silver or copper interlayers. The effect of joining parameters such as bonding temperature, and bonding time was evaluated. The intermetallics always formed in the joining area with a silver (Ag) interlayer. However, Cu interlayer was found to be a viable candidate for joining titanium alloy. At 1000°C or higher joining temperatures, no intermetallics was found in the microstructure of grade-2 Ti bonded area. The microstructure of bonded area was consisted of eutectic mixtures and Ti-Cu solid solutions. The microstructure of Ti-6Al-4V joint centerline was also consisted of eutectic of Cu-Ti and solid solution of Ti-Cu with other alloying elements. The maximum strength obtained for grade-2 Ti joint using Cu interlayer was 470±8 MPa.
AB - The viability of joining of titanium alloy using transient liquid phase (TLP) diffusion bonding was investigated. Commercially pure Ti (grade-2 Ti), and grade-5 (Ti Ti-6Al-4V) have been TLP bonded using silver or copper interlayers. The effect of joining parameters such as bonding temperature, and bonding time was evaluated. The intermetallics always formed in the joining area with a silver (Ag) interlayer. However, Cu interlayer was found to be a viable candidate for joining titanium alloy. At 1000°C or higher joining temperatures, no intermetallics was found in the microstructure of grade-2 Ti bonded area. The microstructure of bonded area was consisted of eutectic mixtures and Ti-Cu solid solutions. The microstructure of Ti-6Al-4V joint centerline was also consisted of eutectic of Cu-Ti and solid solution of Ti-Cu with other alloying elements. The maximum strength obtained for grade-2 Ti joint using Cu interlayer was 470±8 MPa.
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M3 - Conference contribution
AN - SCOPUS:85017109381
T3 - Materials Science and Technology Conference and Exhibition 2016, MS and T 2016
SP - 1089
EP - 1096
BT - Materials Science and Technology Conference and Exhibition 2016, MS and T 2016
PB - Association for Iron and Steel Technology, AISTECH
T2 - Materials Science and Technology Conference and Exhibition 2016, MS and T 2016
Y2 - 23 October 2016 through 27 October 2016
ER -