Weldability of titanium alloy using transient liquid phase diffusion bonding method

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The viability of joining of titanium alloy using transient liquid phase (TLP) diffusion bonding was investigated. Commercially pure Ti (grade-2 Ti), and grade-5 (Ti Ti-6Al-4V) have been TLP bonded using silver or copper interlayers. The effect of joining parameters such as bonding temperature, and bonding time was evaluated. The intermetallics always formed in the joining area with a silver (Ag) interlayer. However, Cu interlayer was found to be a viable candidate for joining titanium alloy. At 1000°C or higher joining temperatures, no intermetallics was found in the microstructure of grade-2 Ti bonded area. The microstructure of bonded area was consisted of eutectic mixtures and Ti-Cu solid solutions. The microstructure of Ti-6Al-4V joint centerline was also consisted of eutectic of Cu-Ti and solid solution of Ti-Cu with other alloying elements. The maximum strength obtained for grade-2 Ti joint using Cu interlayer was 470±8 MPa.

Original languageEnglish (US)
Title of host publicationMaterials Science and Technology Conference and Exhibition 2016, MS and T 2016
PublisherAssociation for Iron and Steel Technology, AISTECH
Pages1089-1096
Number of pages8
ISBN (Electronic)9781510833142
StatePublished - 2016
EventMaterials Science and Technology Conference and Exhibition 2016, MS and T 2016 - Salt Lake City, United States
Duration: Oct 23 2016Oct 27 2016

Publication series

NameMaterials Science and Technology Conference and Exhibition 2016, MS and T 2016
Volume2

Other

OtherMaterials Science and Technology Conference and Exhibition 2016, MS and T 2016
Country/TerritoryUnited States
CitySalt Lake City
Period10/23/1610/27/16

All Science Journal Classification (ASJC) codes

  • Materials Science (miscellaneous)
  • Mechanics of Materials
  • Energy Engineering and Power Technology

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