X-ray and neutron porosimetry as powerful methodologies for determining structural characteristics of porous low-k thin films

Hae Jeong Lee; Bryan D. Vogt; Christopher L. Soles; Da Wei Liu; Barry J. Bauer; Wen Li Wu; Eric K. Lin; Gwi Gwon Kang; Min Jin Ko

X-ray and neutron porosimetry as powerful methodologies for determining structural characteristics of porous low-k thin films

Hae Jeong Lee, Bryan D. Vogt, Christopher L. Soles, Da Wei Liu, Barry J. Bauer, Wen Li Wu, Eric K. Lin, Gwi Gwon Kang, Min Jin Ko

Chemical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

5 Scopus citations

Abstract

Methylsilsesquioxane based porous low-k dielectric films with varying porogen loading have been characterized using X-ray and neutron porosimetry to determine their pore size distribution, average density, wall density, porosity, density profiles, and porosity profiles. The porosity and the average pore size of the sample with 45 % porogen were 52 % and 23 Å in radius, respectively. Pore size was consistent with that from small angle neutron scattering measurements. The wall density was found to be independent of the porogen content and it appeared that the porogen was 100 % effective in generating pores.

Original language	English (US)
Title of host publication	Proceedings of the IEEE 2004 International Interconnect Technology Conference
Pages	136-138
Number of pages	3
State	Published - 2004
Event	Proceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, United States Duration: Jun 7 2004 → Jun 9 2004

Publication series

Name	Proceedings of the IEEE 2004 International Interconnect Technology Conference

Conference

Conference	Proceedings of the IEEE 2004 International Interconnect Technology Conference
Country/Territory	United States
City	Burlingame, CA
Period	6/7/04 → 6/9/04

All Science Journal Classification (ASJC) codes

General Engineering

Cite this

Lee, H. J., Vogt, B. D., Soles, C. L., Liu, D. W., Bauer, B. J., Wu, W. L., Lin, E. K., Kang, G. G., & Ko, M. J. (2004). X-ray and neutron porosimetry as powerful methodologies for determining structural characteristics of porous low-k thin films. In Proceedings of the IEEE 2004 International Interconnect Technology Conference (pp. 136-138). (Proceedings of the IEEE 2004 International Interconnect Technology Conference).

Lee, Hae Jeong ; Vogt, Bryan D. ; Soles, Christopher L. et al. / X-ray and neutron porosimetry as powerful methodologies for determining structural characteristics of porous low-k thin films. Proceedings of the IEEE 2004 International Interconnect Technology Conference. 2004. pp. 136-138 (Proceedings of the IEEE 2004 International Interconnect Technology Conference).

@inproceedings{a3726d481da64cf882e96a233587c3be,

title = "X-ray and neutron porosimetry as powerful methodologies for determining structural characteristics of porous low-k thin films",

abstract = "Methylsilsesquioxane based porous low-k dielectric films with varying porogen loading have been characterized using X-ray and neutron porosimetry to determine their pore size distribution, average density, wall density, porosity, density profiles, and porosity profiles. The porosity and the average pore size of the sample with 45 % porogen were 52 % and 23 {\AA} in radius, respectively. Pore size was consistent with that from small angle neutron scattering measurements. The wall density was found to be independent of the porogen content and it appeared that the porogen was 100 % effective in generating pores.",

author = "Lee, {Hae Jeong} and Vogt, {Bryan D.} and Soles, {Christopher L.} and Liu, {Da Wei} and Bauer, {Barry J.} and Wu, {Wen Li} and Lin, {Eric K.} and Kang, {Gwi Gwon} and Ko, {Min Jin}",

year = "2004",

language = "English (US)",

isbn = "0780383087",

series = "Proceedings of the IEEE 2004 International Interconnect Technology Conference",

pages = "136--138",

booktitle = "Proceedings of the IEEE 2004 International Interconnect Technology Conference",

note = "Proceedings of the IEEE 2004 International Interconnect Technology Conference ; Conference date: 07-06-2004 Through 09-06-2004",

}

Lee, HJ, Vogt, BD, Soles, CL, Liu, DW, Bauer, BJ, Wu, WL, Lin, EK, Kang, GG & Ko, MJ 2004, X-ray and neutron porosimetry as powerful methodologies for determining structural characteristics of porous low-k thin films. in Proceedings of the IEEE 2004 International Interconnect Technology Conference. Proceedings of the IEEE 2004 International Interconnect Technology Conference, pp. 136-138, Proceedings of the IEEE 2004 International Interconnect Technology Conference, Burlingame, CA, United States, 6/7/04.

X-ray and neutron porosimetry as powerful methodologies for determining structural characteristics of porous low-k thin films. / Lee, Hae Jeong; Vogt, Bryan D.; Soles, Christopher L. et al.
Proceedings of the IEEE 2004 International Interconnect Technology Conference. 2004. p. 136-138 (Proceedings of the IEEE 2004 International Interconnect Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - X-ray and neutron porosimetry as powerful methodologies for determining structural characteristics of porous low-k thin films

AU - Lee, Hae Jeong

AU - Vogt, Bryan D.

AU - Soles, Christopher L.

AU - Liu, Da Wei

AU - Bauer, Barry J.

AU - Wu, Wen Li

AU - Lin, Eric K.

AU - Kang, Gwi Gwon

AU - Ko, Min Jin

PY - 2004

Y1 - 2004

N2 - Methylsilsesquioxane based porous low-k dielectric films with varying porogen loading have been characterized using X-ray and neutron porosimetry to determine their pore size distribution, average density, wall density, porosity, density profiles, and porosity profiles. The porosity and the average pore size of the sample with 45 % porogen were 52 % and 23 Å in radius, respectively. Pore size was consistent with that from small angle neutron scattering measurements. The wall density was found to be independent of the porogen content and it appeared that the porogen was 100 % effective in generating pores.

AB - Methylsilsesquioxane based porous low-k dielectric films with varying porogen loading have been characterized using X-ray and neutron porosimetry to determine their pore size distribution, average density, wall density, porosity, density profiles, and porosity profiles. The porosity and the average pore size of the sample with 45 % porogen were 52 % and 23 Å in radius, respectively. Pore size was consistent with that from small angle neutron scattering measurements. The wall density was found to be independent of the porogen content and it appeared that the porogen was 100 % effective in generating pores.

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M3 - Conference contribution

AN - SCOPUS:8644277247

SN - 0780383087

SN - 9780780383081

T3 - Proceedings of the IEEE 2004 International Interconnect Technology Conference

SP - 136

EP - 138

BT - Proceedings of the IEEE 2004 International Interconnect Technology Conference

T2 - Proceedings of the IEEE 2004 International Interconnect Technology Conference

Y2 - 7 June 2004 through 9 June 2004

ER -

X-ray and neutron porosimetry as powerful methodologies for determining structural characteristics of porous low-k thin films

Abstract

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Conference

All Science Journal Classification (ASJC) codes

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