Abstract
The underpotential deposition (u.p.d.) of copper and silver ions on platinum electrodes has been studied using X-ray photoelectron spectroscopy (x.p.s.). A significant chemical shift of the x.p.s. binding energies of the u.p.d. copper and silver atoms relative to bulk copper and silver metal is obtained. Analogous spectral results are obtained for in situ vapor deposition of copper and silver atoms on clean platinum substrates which reveal the metallic nature of the u.p.d. species.
Original language | English (US) |
---|---|
Pages (from-to) | 123-127 |
Number of pages | 5 |
Journal | Journal of Electroanalytical Chemistry |
Volume | 80 |
Issue number | 1 |
DOIs | |
State | Published - Jul 11 1977 |
All Science Journal Classification (ASJC) codes
- Analytical Chemistry
- General Chemical Engineering
- Electrochemistry