Y2BaCuO5as a infstrate for YBa2Cu3Ox

S. E. Dorris, M. T. Lanagan, D. M. Moffatt, H. J. Leu, C. A. Youngdahl, U. Balachandran, A. Cazzato, D. E. Bloomberg, K. C. Goretta

Research output: Contribution to journalArticlepeer-review

15 Scopus citations


Bulk Y2BaCuO5has been found to have a higher stiffness but a lower thermal expansion than YBa2Cu3Ox. Y2BaCuO5exhibits semiconducting behavior at room temperature. Composite tapes consisting of layers of Y2BaCuO5and YBa2Cu3Oxcracked upon sintering because of large differences in shrinkage rate. Addition of 15 volume % Ag to the YBa2Cu3Oxstrengthened the material and prevented cracking.

Original languageEnglish (US)
Pages (from-to)L1415-L1416
JournalJapanese Journal of Applied Physics
Issue number8 A
StatePublished - Aug 1 1989

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)


Dive into the research topics of 'Y2BaCuO5as a infstrate for YBa2Cu3Ox'. Together they form a unique fingerprint.

Cite this